b 7 - 24 0898 ? by semikron skiip 802 gb 061 - 259 ctv absolute maximum ratin g s symbol conditions 1) values units v isol 4) ac, 1min 2500 v t op ,t stg operating / stor. temperature -25...+85 c igbt and inverse diode v ces 600 v v cc 5) operating dc link voltage 400 v i c igbt 800 a t j 3) igbt + diode -40...+150 c i f diode 800 a i fm diode, t p < 1 ms 1600 a i fsm diode, t j = 150 c, 10ms; sin 8000 a i 2 t (diode) diode, t j = 150 c, 10ms 320 kas 2 driver v s1 stabilized power supply 18 v v s2 non-stabilized power supply 30 v f smax switching frequency 20 khz dv/dt primary to secondary side 75 kv/s characteristics symbol conditions 1) min. typ. max. units igbt 11) v (br)ces driver without supply 3 v ces -- v i ces v ge = 0, t j = 25 c v ce = v ces t j = 125 c - - - 12 0,8 - ma ma v to t j = 125 c -- 0,94 v r t t j = 125 c -- 2,1 m w v cesat i c = 800a, t j = 125 c -- 2,6 v v cesat i c = 800a, t j = 25 c -- 2,60 v e on + e off v cc =300/400v,i c =800a t j = 125 c -- 72/102 mj c chc per phase , ac side - 1 , 6 - nf l ce top, bottom - 7,5 - nh inverse diode 2) v f = v ec i f = 800a; t j = 125 c -- 1,72 v v f = v ec i f = 800a t j = 25 c -- 1,75 v e on + e off i f = 800a; t j = 125 c -- 24 mj v to t j = 125 c -- 0,78 v r t t j = 125 c -- 1,2 m w thermal characteristics r thjs 10) per igbt -- 0,050 k/w r thjs 10) per diode -- 0,094 k/w r thsa 6,10) p16 heatsink; see case s2 -- 44 k/kw driver i s1 supply current 15v-supply 210+390*f s /f smax +1,3*i ac /a ma i s2 supply current 24v-supply 160+290*f s /f smax +1,0*i ac /a ma t interlock-driver interlock-time 2,3 s skiippack protection i tripsc short circuit protection 826 a i triplg ground fault protection a t trip over-temp. protection 115 c u dctrip 9) u dc -protection 410 v mechanical data m1 dc terminals, si units 4 - 6nm m2 ac terminals, si units 8 - 10 nm skiippack a a a a sk integrated intelligent power pack halfbridge skiip 802 gb 061 - 259 ctv 7,9) preliminary data case s2 features short circuit protection, due to evaluation of current sensor signals isolated power supply low thermal impedance optimal thermal management with integrated heatsink pressure contact technology with increased power cycling capability, compact design low stray inductance high power, small losses over-temperature protection 1) t heatsink = 25 c, unless otherwise specified 2) cal = controlled axial lifetime technology (soft and fast) 3) without driver 4) driver input to dc link / ac output to dc link / ac output to heatsink 5) with semikron-dc link (low inductance) 6) other heatsinks on request 7) c - integrated current sensors t - temperature protection v - 15 v or 24 v power supply 8) ac connection busbars must be connected by the user; copper busbars available on request 9) options available for driver: u - dc link voltage sense f C fiber optic connector 10) s referenced to temperature sensor 11) npt-technology with homo- genous current-distribution
? by semikron 0898 b 7 C 10 pin si g nal remark 1 shield connected to gnd, when shielded cable is used 2 bot in 4) positive 15v cmos lo g ic; 10 k w impedance, dont connect when usin g fiber optic 3 error out 1) low = no error; open collector output; max. 30 v / 15 ma dont connect when usin g fiber optic, propa g ation delay 1 m s min. pulsewidth error-memory-reset 8 m s 4 top in 4) positive 15v cmos lo g ic; 10 k w impedance dont connect when usin g fiber optic 5 overtemp. out 1) low = no error = j dcb < 115 + 5c open collector output; max. 30 v / 15 ma ?low output volta g e < 0,6 v ?hi g h output volta g e max. 30 v 6+ 24 v dc in 24 v dc (20 - 30 v) 7+ 24 v dc in dont supply with 24 v, when usin g + 15 v dcin supply volta g e monitorin g threshold 19,5 v 8+ 15 v dc in 15 v dc + 4 % 9+ 15 v dc in dont supply with 15 v, when usin g + 24 v dcin supply volta g e monitorin g threshold 13 v 10 gnd gnd for power supply and 11 gnd gnd for di g ital si g nals 12 temp. analo g out or u dc analo g out 2) u dc when usin g option u actual dc-link volta g e, 9 v refer to u dcmax max. output current 5 ma; overvolta g e trip level 9 v 13 gnd aux 3) gnd for analo g si g nals 14 i analo g out current actual value, 8,0 v refer to i c @ 25 c overcurrent trip level 10 v ? 125 % i c @ 25 c current value > 0 ? skiip is source current value < 0 ? skiip is sink type gal as type gb except - pin x1-4: connect this pin to gnd - top switch does not exist pin-array - halfbridge driver skiippack 2-fold type gb x1: x10: halfbridge 1 (hb1) out pin si g nal 1 2 8 collector top (hb1) 11 gate top (hb1) 12 emitter top (hb1) 13 collector bot (hb1) 16 gate bot (hb1) 17 emitter bot (hb1) x11: halfbridge 2 (hb2) out pin si g nal 1 temp.-sensor (hb2)1 2 temp.-sensor (hb2)2 8 collector top (hb2) 11 gate top (hb2) 12 emitter top (hb2) 13 collector bot (hb2) 16 gate bot (hb2) 17 emitter bot (hb2) 1) open collector output, external pull up resistor necessary 2) when usin g option u the analo g temperature si g nal is not available 3) gnd aux = reference for analo g output si g nals 4) ?hi g h (min) 11,2 v ?low (max) 5,4 v type gar as type gb except - pin x1-2: connect this pin to gnd - bottom switch does not exist
? by semikron 0898 b 7 C 2 case s2 skiippack 2 - gb; gh wei g ht without heatsink: 1,85 k g p16: 4,7 k g skiippack 2 - gb with f-option
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